S29AL032D70BFI000

32MB NOR Flash 3V Parallel 70ns Flash
4,604 有效庫存

S29AL032D70BFI000

有效庫存4,604

32MB NOR Flash 3V Parallel 70ns Flash

  • 製造商零件號 # : S29AL032D70BFI000

  • 包裝/封裝: BGA-48

  • 製造商: Spansion

  • 產品分類 : Memory

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S29AL032D70BFI000 數據表
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S29AL032D70BFI000 詳細說明

The S29AL032D70BFI000 is a flash memory chip manufactured by Cypress Semiconductor. It belongs to the NOR Flash family and has a capacity of 32 megabits (Mb), organized into 4 megabytes (MB). This chip operates on a 3.3-volt power supply and supports a fast asynchronous interface. It offers a symmetrically blocked architecture, allowing for simultaneous program and erase operations within multiple memory blocks. With a typical access time of 70 nanoseconds (ns), it delivers high-speed data transfer rates, making it suitable for various applications requiring rapid access to non-volatile memory, such as embedded systems, consumer electronics, and automotive applications.The "BFI" in the part number refers to the package type, which in this case is a 48-ball fine-pitch BGA (Ball Grid Array), facilitating compact and reliable mounting on printed circuit boards.

S29AL032D70BFI000

主要特徵

  • 32 Megabit flash memory
  • 3V power supply
  • Compatible with JEDEC standard
  • Fast read and program operations
  • Low power consumption
  • Versatile memory organization

應用

  • Automotive: used in engine control units, airbag systems, and entertainment systems
  • Industrial: used in automation and control systems, and in data storage for equipment monitoring
  • Telecommunications: used in routers, switches, and network storage devices
  • Consumer electronics: used in smartphones, tablets, and digital cameras for data storage
  • Medical devices: used in imaging equipment, patient monitoring systems, and diagnostic devices

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Rohs Code Yes Part Life Cycle Code Transferred
ECCN Code EAR99 HTS Code ! 8542.32.00.51
Access Time-Max 70 ns Command User Interface YES
Common Flash Interface YES Data Polling YES
JESD-30 Code R-PBGA-B48 Memory Density 33554432 bit
Memory IC Type FLASH Memory Width 8
Number of Sectors/Size 64 Number of Terminals 48
Number of Words 4194304 words Number of Words Code 4000000
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Organization 4MX8 Package Body Material PLASTIC/EPOXY
Package Code FBGA Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR Package Style GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL Power Supplies ! 3/3.3 V
Qualification Status ! Not Qualified Ready/Busy YES
Sector Size 64K Standby Current-Max 0.000005 A
Supply Current-Max 0.035 mA Surface Mount ! YES
Technology CMOS Temperature Grade ! INDUSTRIAL
Terminal Form ! BALL Terminal Pitch ! 0.8 mm
Terminal Position BOTTOM Toggle Bit YES
Type NOR TYPE

數據表 PDF

數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。

初步規格 S29AL032D70BFI000 PDF 下載

常見問題解答

What is S29AL032D70BFI000?

The S29AL032D70BFI000 is a 32-megabit (4M x 8/2M x 16) CMOS 3.0 Volt-only boot sector Flash memory device designed by Cypress Semiconductor. It is ideal for applications requiring non-volatile storage with high density, high reliability, and fast access times, such as embedded systems, consumer electronics, and automotive applications.

How Does S29AL032D70BFI000 Work?

The S29AL032D70BFI000 works by storing data in an array of memory cells that can be electrically erased and programmed. It utilizes a 3.0-volt power supply and features a boot sector architecture for secure code storage and execution. The flash memory device offers fast access times and high reliability for data storage and code execution in various applications.

How Many Pins does S29AL032D70BFI000 have and What are the Functions of the Pinout Configuration?

The S29AL032D70BFI000 is housed in a 48-ball Fine-Pitch Ball Grid Array (FBGA) package. The pinout configuration includes:

  • A0-A20: Address input pins for memory addressing.
  • DQ0-DQ15: Data input/output pins for bidirectional data transfer.
  • CE1, CE2: Chip enable inputs for device selection.
  • OE#: Output enable input for data output control.
  • WE#: Write enable input for data programming control.
  • RP#, RY/BY#, EAI#: Additional control input/output pins for device operations.
  • VCC, VCCQ, VSS: Power and ground pins for device operation.

What are the Pros and Cons of S29AL032D70BFI000?

Pros:

  • High Density: Offers 32-megabit capacity for large data storage requirements.
  • Faster Access Times: Provides fast read and program/erase cycles for efficient data access.
  • Boot Sector Architecture: Includes a boot sector for secure code storage and execution.
  • Reliability: Features high reliability and endurance for critical data storage applications.
  • Compact Package: Housed in a compact FBGA package for space-efficient designs.

Cons:

  • Complex Interface: May require careful interface design for optimal performance and reliability.
  • Cost: High-density flash memory devices may have a higher cost compared to lower-density alternatives.
  • Endurance Limitation: Flash memory cells have a finite number of program/erase cycles, requiring careful management in write-intensive applications.

Are There Any Equivalents/Alternatives to S29AL032D70BFI000 for Recommendation?

  • The S29AL032D90BFI023 from Cypress Semiconductor is a similar 32-megabit flash memory with different operating parameters.
  • Alternatives to the S29AL032D70BFI000 include the MT28EW from Micron Technology and the W25Q32JV from Winbond Electronics.

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