PC28F256P33BFE

Flash memory chip with a capacity of 16 megabytes by 16 bits, operating at a speed of 95 nanoseconds, in a PBGA64 package with a BGA-64 configuration
6,587 有效庫存

PC28F256P33BFE

有效庫存6,587

Flash memory chip with a capacity of 16 megabytes by 16 bits, operating at a speed of 95 nanoseconds, in a PBGA64 package with a BGA-64 configuration

  • 製造商零件號 # : PC28F256P33BFE

  • 包裝/封裝: BGA-64

  • 製造商: Micron

  • 產品分類 : Memory

  • 系列 : PC28F256

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PC28F256P33BFE 數據表

價格 (USD)

數量 單價 總價
1 $16.593 $16.59
300 $6.622 $1,986.60
600 $6.400 $3,840.00
900 $6.291 $5,661.90

這些價格會受到市場波動的影響，需要提交報價才能取得最新價格。

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PC28F256P33BFE 詳細說明

When it comes to reliable memory solutions, Microchip Technology's PC28F256P33BFE is a top choice. With its 256Mb capacity, voltage range of 2.7V to 3.6V, and fast access time of 70ns, it is well-suited for industrial automation, automotive, telecommunications, and consumer electronics applications. Its symmetrical block architecture and integrated Command Set Algorithm ensure flexible data storage and enhanced error correction and detection capabilities. Plus, with high reliability, endurance, and data retention, this Flash memory device offers peace of mind for your project's memory needs

PC28F256P33BFE

主要特徵

  • High performance
  • — 85/88 ns initial access
  • — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
  • — 25 ns asynchronous-page read mode
  • — 4-, 8-, 16-, and continuous-word burst mode
  • — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
  • — 1.8 V buffered programming at 7 µs/byte (Typ)
  • Architecture
  • — Multi-Level Cell Technology: Highest Density at Lowest Cost
  • — Asymmetrically-blocked architecture
  • — Four 32-KByte parameter blocks: top or bottom configuration
  • — 128-KByte main blocks
  • Voltage and Power
  • —VCC(core) voltage: 1.7 V – 2.0 V
  • —VCCQ (I/O) voltage: 1.7 V – 3.6 V
  • — Standby current: 55 µA (Typ) for 256-Mbit
  • — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
  • Quality and Reliability
  • — Operating temperature: –40 °C to +85 °C
  • 1-Gbit in SCSP is –30 °C to +85 °C
  • — Minimum 100,000 erase cycles per block
  • — ETOX™ VIII process technology (130 nm)
  • Security
  • — One-Time Programmable Registers:
  • 64 unique factory device identifier bits
  • 64 user-programmable OTP bits
  • Additional 2048 user-programmable OTP bits
  • — Selectable OTP Space in Main Array:
  • 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
  • — Absolute write protection: VPP= VSS
  • — Power-transition erase/program lockout
  • — Individual zero-latency block locking
  • — Individual block lock-down
  • Software
  • — 20 µs (Typ) program suspend
  • — 20 µs (Typ) erase suspend
  • —Intel® Flash Data Integrator optimized
  • — Basic Command Set and Extended Command Set compatible
  • — Common Flash Interface capable
  • Density and Packaging
  • — 64/128/256-Mbit densities in 56-Lead TSOP package
  • — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
  • — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
  • — 16-bit wide data bus

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Product Category ! NOR Flash Brand Alliance Memory
Product Type ! NOR Flash Factory Pack Quantity 300
Subcategory Memory & Data Storage

數據表 PDF

數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。

初步規格 PC28F256P33BFE PDF 下載

常見問題解答

What is PC28F256P33BFE?

The PC28F256P33BFE is a 256Mb (32MB) parallel NOR flash memory device designed by Intel Corporation. It is commonly used in embedded systems, automotive, networking, and telecommunications applications that require non-volatile storage with high reliability and performance.

How Does PC28F256P33BFE Work?

The PC28F256P33BFE works by storing data in memory cells that retain their state even when power is removed. It utilizes a parallel interface to communicate with the host microcontroller or processor and can be read from or written to using memory-specific instructions. The device offers fast access times and high endurance, making it suitable for various storage requirements in electronic systems.

How Many Pins does PC28F256P33BFE have and What are the Functions of the Pinout Configuration?

The PC28F256P33BFE is housed in a 64-ball fine-pitch ball grid array (FBGA) package. The pinout configuration includes:

  • Data[0:15]: Parallel data input/output pins for the memory interface.
  • Address[0:23]: Address pins for memory access.
  • Control Pins: Includes control pins for chip enable, output enable, and write enable signals.
  • Power Pins: Includes VCC and ground pins for power supply and ground connection.
  • NC Pins: No connection pins for mechanical stability and thermal management.

What are the Pros and Cons of PC28F256P33BFE?

Pros:

  • High Capacity: Provides 256Mb of non-volatile storage for data and program storage.
  • Fast Access Times: Offers fast read and write access times for efficient data transfer.
  • Reliability: Designed for high reliability and long data retention, suitable for critical applications.
  • Parallel Interface: Utilizes a parallel interface for high-speed data transfer with the host system.

Cons:

  • Complexity: Requires knowledge of memory interfacing and control for proper integration.
  • Package Size: The small FBGA package may require special handling and PCB layout considerations.
  • Cost: Higher capacity NOR flash memory devices may have a higher cost compared to lower capacity alternatives.

Are There Any Equivalents/Alternatives to PC28F256P33BFE for Recommendation?

  • An equivalent part to the PC28F256P33BFE is the S29GL256P11TFI013 from Cypress Semiconductor.
  • Alternatives to the PC28F256P33BFE include the AM29LV256ML123REI from AMD and the W25Q256FV from Winbond.

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