NAND256W3A2BN6E

有效庫存6,857

NAND256W3A2BN6E is a reliable and efficient storage solution for various applications requiring fast data processing

  • 製造商零件號 # : NAND256W3A2BN6E

  • 包裝/封裝: TSOP-48

  • 製造商: Micron

  • 產品分類 : Memory

  • 系列 : NAND256

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NAND256W3A2BN6E 數據表

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NAND256W3A2BN6E 詳細說明

When it comes to reliable and high-performance storage solutions, the NAND256W3A2BN6E chip shines as a top contender in the NAND flash memory market. Its robust design, coupled with a capacious 256 gigabits (Gb) capacity, makes it a preferred choice for OEMs looking to enhance the storage capabilities of their products. The intricate alphanumeric code assigned to the chip signifies intricate details regarding its design, functionality, and manufacturing processes. As a key component in smartphones, tablets, and SSDs, the NAND256W3A2BN6E chip plays a crucial role in ensuring seamless data storage and retrieval, meeting the needs of today's consumer electronics landscape

NAND256W3A2BN6E

主要特徵

  • HIGH DENSITY NAND FLASH MEMORIES
  • – Up to 1 Gbit memory array
  • – Up to 32 Mbit spare area
  • – Cost effective solutions for mass storage applications
  • NAND INTERFACE
  • – x8 or x16 bus width
  • – Multiplexed Address/ Data
  • – Pinout compatibility for all densities
  • SUPPLY VOLTAGE
  • – 1.8V device: VDD = 1.7 to 1.95V
  • – 3.0V device: VDD = 2.7 to 3.6V
  • PAGE SIZE
  • – x8 device: (512 + 16 spare) Bytes
  • – x16 device: (256 + 8 spare) Words
  • BLOCK SIZE
  • – x8 device: (16K + 512 spare) Bytes
  • – x16 device: (8K + 256 spare) Words
  • PAGE READ / PROGRAM
  • – Random access: 12µs (max)
  • – Sequential access: 50ns (min)
  • – Page program time: 200µs (typ)
  • COPY BACK PROGRAM MODE
  • – Fast page copy without external buffering
  • FAST BLOCK ERASE
  • – Block erase time: 2ms (Typ)
  • STATUS REGISTER
  • ELECTRONIC SIGNATURE
  • CHIP ENABLE ‘DON’T CARE’ OPTION
  • – Simple interface with microcontroller
  • SERIAL NUMBER OPTION
  • HARDWARE DATA PROTECTION
  • – Program/Erase locked during Power transitions
  • DATA INTEGRITY
  • – 100,000 Program/Erase cycles
  • – 10 years Data Retention
  • RoHS COMPLIANCE
  • – Lead-Free Components are Compliant with the RoHS Directive
  • DEVELOPMENT TOOLS
  • – Error Correction Code software and hardware models
  • – Bad Blocks Management and Wear Leveling algorithms
  • – File System OS Native reference software
  • – Hardware simulation models

規格

以下是所選零件的基本參數,涉及零件的特性及其所屬類別。

Product Category ! NAND Flash RoHS Details
Mounting Style SMD/SMT Package / Case TSOP-48
Series NAND256-A Memory Size ! 256 Mbit
Interface Type Parallel Organization 32 M x 8
Timing Type Asynchronous Data Bus Width 8 bit
Supply Voltage - Min 2.7 V Supply Voltage - Max 3.6 V
Supply Current - Max 20 mA Minimum Operating Temperature - 40 C
Maximum Operating Temperature ! + 85 C Active Read Current - Max 20 mA
Architecture Multiplane Brand STMicroelectronics
Memory Type ! NAND Moisture Sensitive Yes
Product NAND Flash Product Type ! NAND Flash
Speed 50 ns Standard Not Supported
Factory Pack Quantity 96 Subcategory Memory & Data Storage

數據表 PDF

數據表記錄了器件的特性、絕對最大額定值、應用等,這對於作為器件特定應用的整體指南大有裨益。

初步規格 NAND256W3A2BN6E PDF 下載

常見問題解答

What is NAND256W3A2BN6E?

The NAND256W3A2BN6E is a 256 Mbit (32M x 8 bit / 16M x 16 bit) NAND flash memory device designed by Micron Technology. It is ideal for applications requiring non-volatile storage with high-density, such as solid-state drives, digital cameras, and embedded systems.

How Does NAND256W3A2BN6E Work?

The NAND256W3A2BN6E works by storing digital information in a non-volatile manner using NAND flash memory cells. It utilizes a multiplexed address/data bus and a command register to perform read, program, and erase operations. The device features a built-in error correction code (ECC) to ensure data integrity.

How Many Pins does NAND256W3A2BN6E have and What are the Functions of the Pinout Configuration?

The NAND256W3A2BN6E is housed in a 48-pin TSOP (Thin Small Outline Package) package. The pinout configuration includes:

  • IO0-IO7: I/O data bus for 8-bit or 16-bit operation.
  • ALE: Address latch enable for multiplexed address/data.
  • CLE: Command latch enable for command input.
  • CE: Chip enable for device selection.
  • WE: Write enable for write operations.
  • RE: Read enable for read operations.
  • R/B: Ready/busy output for status indication.
  • WP: Write protect for hardware data protection.
  • VCC, VSS: Power supply and ground pins.

What are the Pros and Cons of NAND256W3A2BN6E?

Pros:

  • High Density: Offers 256 Mbit of storage capacity for data-intensive applications.
  • Non-Volatile Storage: Retains data even when power is removed, suitable for storage applications.
  • Error Correction: Includes built-in ECC to ensure data integrity.
  • Fast Access Times: Provides fast read and program times for efficient data storage.
  • Industrial Temperature Range: Suitable for harsh environmental conditions in industrial applications.

Cons:

  • Complex Interface: Requires careful handling of address, command, and data signals for proper operation.
  • Endurance Limit: NAND flash memory has a limited number of program/erase cycles compared to other non-volatile memories.
  • Write Performance: Write operations may require additional time due to the nature of flash memory technology.

Are There Any Equivalents/Alternatives to NAND256W3A2BN6E for Recommendation?

  • The S34ML08G2 from Cypress Semiconductor is a similar 256 Mbit NAND flash memory device with additional features.
  • Alternatives to the NAND256W3A2BN6E include the MT29F256G08CJAAA from Micron Technology and the IS37SML01G1 from ISSI (Integrated Silicon Solution, Inc.).

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NAND256W3A2BN6E

有效庫存6,857