MT53D512M32D2DS-046 AAT:D

Name: MT53D512M32D2DS-046 AAT:D
Brand: Micron
Rating: 4.5 (10 reviews)
Author: Lisleapex

Dual-die LPDDR4 memory module with 16GHz speed and 512MX32 capacity

6,247 有效庫存

MT53D512M32D2DS-046 AAT:D

有效庫存6,247

Dual-die LPDDR4 memory module with 16GHz speed and 512MX32 capacity

製造商零件號 # : MT53D512M32D2DS-046 AAT:D
包裝/封裝: VFBGA-200
零件狀態 : OBSOLETE
製造商: Micron
產品分類 : Memory
系列 : MT53D512

品質保證

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關於包裝

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例子

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MT53D512M32D2DS-046 AAT:D 數據表

目前的價格方案正在編制中。請聯絡我們的客戶服務團隊獲取最新的價格資訊。感謝您的理解和支援!

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MT53D512M32D2DS-046 AAT:D 詳細說明

The MT53D512M32D2DS-046 AAT:D is a Mobile LPDDR4 memory IC with a capacity of 16Gbit. It operates at a speed of 2.133 GHz, making it suitable for high-performance mobile devices such as smartphones, tablets, and other portable electronics. The IC is housed in a compact 200-WFBGA package measuring 10x14.5mm, which helps conserve space in small form factor devices. As a Low Power Double Data Rate 4 (LPDDR4) memory IC, the MT53D512M32D2DS-046 AAT:D offers improved power efficiency compared to its predecessors, helping to extend battery life in mobile devices. This makes it an ideal choice for devices that require both high performance and long battery runtimes. The MT53D512M32D2DS-046 AAT:D is designed to meet the demanding requirements of modern mobile applications, providing fast and reliable memory performance to support seamless multitasking, gaming, multimedia, and other intensive tasks. Its high capacity and speed make it suitable for handling large amounts of data quickly and efficiently.

主要特徵

512Mb memory size
32M x 32 configuration
Double data rate type
Synchronous interface
Maximum clock frequency of 933MHz
Operating voltage range of 1.14V to 1.26V
Available in an FBGA package
RoHS compliant

應用

Mobile phones
Tablets
Laptops
Portable gaming devices
Digital cameras
Automotive infotainment systems
Industrial systems
Networking equipment
Medical devices
Smart home appliances

規格

以下是所選零件的基本參數，涉及零件的特性及其所屬類別。

Product Category !	DRAM	RoHS	Details
Type	SDRAM Mobile - LPDDR4	Mounting Style	SMD/SMT
Package / Case	VFBGA-200	Data Bus Width	32 bit
Organization	512 M x 32	Memory Size !	16 Gbit
Maximum Clock Frequency	2.133 GHz	Supply Voltage - Max	1.1 V
Minimum Operating Temperature	- 40 C	Maximum Operating Temperature !	+ 105 C
Series	110S	Brand	Micron
Moisture Sensitive	Yes	Product Type !	DRAM
Factory Pack Quantity	1360	Subcategory	Memory & Data Storage
Unit Weight	0.146588 oz

數據表 PDF

數據表記錄了器件的特性、絕對最大額定值、應用等，這對於作為器件特定應用的整體指南大有裨益。

初步規格 MT53D512M32D2DS-046 AAT:D PDF 下載

常見問題解答

What is MT53D512M32D2DS-046 AAT:D?

The MT53D512M32D2DS-046 AAT:D is a 16Gb DDR4 SDRAM module manufactured by Micron Technology. It is designed for high-performance computing and server applications requiring fast and reliable memory access.

How Does MT53D512M32D2DS-046 AAT:D Work?

The MT53D512M32D2DS-046 AAT:D operates as a Double Data Rate 4 (DDR4) synchronous dynamic random-access memory. It provides high-speed data transfer rates and low power consumption, enhancing overall system performance. The module communicates with the system controller to store and retrieve data during read and write operations.

How Many Pins does MT53D512M32D2DS-046 AAT:D have and What are the Functions of the Pinout Configuration?

The MT53D512M32D2DS-046 AAT:D typically features 260 pins in a small outline dual in-line memory module (SODIMM) form factor. The pinout configuration includes:

Data Pins (DQ): Bi-directional data input/output pins for communication with the memory controller.
Address Pins (A): Specify the memory location for read/write operations.
Control Pins (RAS, CAS, WE): Row address strobe, column address strobe, and write enable control pins.
Power Pins (VDD, VSS): Supply power and ground connections for the module.
Clock Pins (CK, CK#): Clock input/output for synchronization with the system clock.
Error Checking Pins (ECC): Additional pins for error detection and correction.

What are the Pros and Cons of MT53D512M32D2DS-046 AAT:D?

Pros:

High Performance: Offers fast data transfer rates and low latency for improved system responsiveness.
Reliability: Provides stable memory operation and data integrity for critical applications.
Energy Efficiency: Utilizes low power consumption to optimize energy usage in computing systems.
Density: 16Gb capacity allows for large amounts of data storage and processing.

Cons:

Cost: Higher density and performance may result in a higher price point compared to lower-capacity modules.
Compatibility: Compatibility with specific systems and configurations may vary, requiring verification before installation.
Heat Dissipation: Intensive computing tasks may generate heat, requiring adequate cooling solutions for optimal performance.